Zigui SMD LED process fills the gap with extremely high commercial value

The light emitting angle is increased from 120 degrees to 150 degrees, the light emitting efficiency is increased by 20%, the packaging cost is reduced by more than 50%, and the product life is extended by more than 30%, which fills the gap of the patch LED application in outdoor high-definition electronic display screens. It was learned yesterday that the “New SMD LED packaging process” of Zigui Hubei Xintong Electronics Co., Ltd. was recognized to have reached the international advanced level, and the “press injection method packaging technology” has reached the international advanced level.

The company's first integrated circuit packaging process, the injection molding method of packaging LED, is a major technological innovation in LED packaging. The process can be widely used in lighting, backlight source, flexible lamp strips, electronic display screens and other fields, filling the blank of the SMD LED applied to high-definition electronic display screens, which has extremely high commercial value.