SMD component packaging method and material tape

Patent Name Packaging Element Packaging Method and Material Belt Patent Applicant Xiang Ping Primary Applicant Address 300074 Tianjin Hexi District Meteorological Station Road No. 99 Inventor Xiang Ping Application (Patent) No. 200410019456.9 Date of Application 2004.05.31 Award Date Approval Notice No. 1583514 Auditing Notice Day 2005.02.23 Manual Disc No. D0508 Main Classification No. B65B15/04 Classification No. B65B15/04; B65B61/02; B65B61/26; B65D73/02 Sub-division Original Application No. Priority Abstracts This invention discloses a The method for packaging a patch element and its material tape, and the packaging method for the patch element of the present invention include: placing a patch element in a feed groove on a carrier tape, covering the film cover tape, and winding the material tape carrying the patch element Go to the disc. It also includes the steps of: marking the information symbol representing the number of the patch elements on the tape at certain intervals; and marking the information symbol representing the parameters of the patch elements on the tape at certain intervals. According to the present invention, a material tape carrying a chip component has a material groove provided on the material tape, a test hole is arranged in the material material groove, and an information symbol representing the number of the patch elements and parameters representing the patch element are arranged on the material tape at certain intervals. Information symbol. The material tape of the present invention is marked with an information symbol representing the number of components of the chip. In the production, the inventory counting method of the component is simplified, the counting time is shortened, and the production line is wasted. The material tape is marked with information symbols representing the parameters of the patch element. Can prevent the wrong material. Sovereign Item 1. A method for packaging a patch element, comprising placing a patch element in a feed slot on a carrier tape, covering the film cover tape, and winding a tape carrying a patch element onto the disk. Yes, it also includes the steps of marking the information symbol representing the number of patch elements on the tape at regular intervals.