Introduction to the production process of SMD surface-adhesive LED

Everyone should be familiar with the LED field, we will continue to talk more about LED related knowledge and knowhow, and today is the production process description of surface mount (SMS, SMT, surface mount) LED.

Solid crystal: In this part, the chip is mainly fixed to the corresponding bracket. Before the solid crystal, it is necessary to determine the type and model of the bracket. The bracket is currently divided into two categories, one is the TOP bracket and the other is the PCB bracket. . Different brackets have slightly different manufacturing processes in the later process, which will be discussed later. After the stent is determined, because the chip needs to be fixed before the solid crystal, it is necessary to first put some glue in the stent, and the glue mainly serves to fix the effect. However, dispensing is not a separate link, but is combined with solid crystals as "solid crystal" because two steps are implemented on the same machine.

Bonding wire: After the completion of baking, the solid crystal is completed and the next step is the “welding line”. There is no special place for the welding wire, mainly to correct the positive and negative polarity, while preventing the virtual welding or as little as possible.

Sealing: The wire is completed and enters the sealing station. In this station, the PCB bracket and the ball-shaped TOP bracket need to enter the “molding” room for sealing, and most of the TOP brackets are not used, directly in the sealing room through a semi-automatic sealing machine. Plastic closures.

Cutting: The sealant is completed and enters the next station "cutting". The cutting of the PCB holder needs to be realized by a high-speed automatic water cutting machine, which can greatly improve the cutting efficiency at a speed of 15,000 rpm. The TOP bracket does not go through this process and goes directly to the next process.

Appearance: This station is mainly to check whether the appearance of the TOP bracket lamp after sealing and the lamp of the PCB board after cutting has foreign matter, bubbles, broken crystals, etc.

Electrical measurement: This section is mainly to test whether there is leakage.

Pulling down: Pull down the LED lights that have been done in the previous process to get into the next step of the spectroscopic test.

Spectroscopic: Different from the LED production line, the SMD SMD LED's spectroscopic and packaging equipment is very one-to-one correspondence. A fully automatic machine only corresponds to one model of the product, so in the later stage of the separation and separation In the packaging stage, a large number of manual manual operations are used. Therefore, in the later market development, the equipment of the existing machine should be fully utilized, and the suitable products should be introduced to the customers in a targeted manner.

Packing: Products that have been separated by color separation are packaged according to certain specifications and stored in the warehouse. There are a few common sense questions at this stage:
1. Usually only white light needs to be split and split, according to the X and Y axis parameters of the white block diagram. Other common lighting products do not require splitting.

2, basically need to vacuum packaging when packaging, according to different models, the number of each package will be different, generally 1608 each plastic wheel package is full of 4K, 3508 about 2K, 5060 only 1K.