SMD solution providers involved in the semiconductor industry

As a pick-up & patch solution provider, Assembléon collaborated with local company Xima Technologies to launch the A-Series Hybrid, a new semiconductor specialization solution under the A-Serie camp. At Assembléon, which will be the first official debut in the semiconductor industry at this year's Taiwan International Semiconductor Fair, the A-Series Hybrid will use Assembléon's proven parallel placement technology for backends such as system-level packaging, multi-chip module manufacturing, and flip chip bonding. Application area. Parallel placement technology, in conjunction with Assembléon's unique Programmable Chip Force Control, solves a common problem in semiconductor backend processes—component damage due to missing control of the placement process. Assembléon's fluxing table and high-precision camera on the A-Series platform are new features designed specifically for semiconductor applications. They provide a strong guarantee for high-quality processing of common back-end applications.

High-speed, high-precision, stand-alone solutions for bare chip bonding and component mounting In addition to the above-mentioned unique features, the A-Series Hybrid can also bond flip chips with 10 micron repeatability, and its mounting speed can be Record record of 2,500 components per hour per head. The bonding speed of bare chips is 3,500 cph for each patch head, with an accuracy of 25 micrometers; and passive components can be mounted at speeds up to 8,000 cph with an accuracy of 40 micrometers. This also includes the soldering action. The first A-Series Hybrid models on the market can be equipped with up to three dedicated dual placement robots (TPRs), each equipped with two patch heads, enabling a total of 15,000 placements per hour per machine Flip chip. In addition to the exclusive TPR, the A-Series Hybrid can also be equipped with a conventional placement robot that can mount passive components as small as 01005 (0402M metric code) at high speed. In fact, users can use any robot arm to mount passive components or chips according to specific application requirements.

Patrick Huberts, project manager of the A-Series Hybrid, said: "The SiP, MCM and high-performance flip chip modules in the semiconductor industry require multiple devices to mount chip components and high-quality chips, and now only one machine is required to complete them. This makes the A-Series Hybrid a truly stand-alone solution that can reduce production and investment costs for module manufacturers. In addition, the use of proven parallel placement technology can also improve the quality of end products in the semiconductor industry. Manufacturers provide a great deal of flexibility and can put a variety of different types of components on one device for assembly, so it also saves valuable floor space."