Dazu Optoelectronics will bring high-speed automatic SMD gold wire bonding machine to the 2013 High-tech LED Lighting Exhibition

[Text / high-tech LED reporter Gao Jinyu] " This year's sales increased by 30% compared with last year, but the market has faded in the next half of the year, are digesting the inventory in the first half." Shenzhen Dazu Optoelectronic Equipment Co., Ltd. (hereinafter referred to as "Da He Yunbo, general manager of Optoelectronics, has the same feelings as many packaging equipment manufacturers. The LED industry is full of irrational investments, and the demand in the terminal market has not continued to grow substantially as expected.

As equipment manufacturers' profits have been declining year after year, packaging equipment manufacturers have also focused on the speed and capacity of equipment from now on, and now they pay more attention to the comprehensive performance of equipment, especially in terms of equipment accuracy, stability and reliability. The equipment industry has begun to return to rationality.

He Yunbo introduced that the four main packaging equipments of Dazu Optoelectronics are wire bonding machines, solid crystal machines, beam splitters and tape machines. Among them, the wire bonding machine is the product that Dazu Optoelectronics introduced to the market at the latest, and has now become the leading product of the company. On November 25th, Dazu Optoelectronics will bring the high-speed automatic SMD gold wire bonding machine to the 2013 High-tech LED Lighting Exhibition.

HANS5201 flat wire bonding machine

The wire bonding machine is the most important part of the whole packaging process, and the technical difficulties are many, which can best reflect the competitive advantage of the enterprise. Among the latest products that Dazu Optoelectronics pushes this year, the high-speed automatic SMD gold wire bonding machine is the most complicated and technically difficult. This year, Dazu Optoelectronics officially released the news of the new high-speed automatic wire bonding machine, including the flat wire bonding machine HANS-5200, HANS-5201, and the straight wire bonding machine HANS-5100 and HANS-5110.

He Yunbo said that the HANS5201 fully automatic SMD wire bonding machine of Dazu Optoelectronics is close to the international level while ensuring the welding precision and the mass production reliability. In addition, the high-speed automatic in-line wire bonding machine HANS5110 independently developed by Dazu Optoelectronics has even surpassed the latest models of similar international products.